Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging

Journal content Created on 16 Sep 2026 Angewandte Chemie Int Ed

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Angewandte Chemie Int Ed, Wiley-VCH

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Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging

Huarui Yao, Chang Jing, Aiqing Dong, Yanyun Li, Xiaoma Fei, Junying Zhang, Jiahao Ma, Jue Cheng

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