A ligand oxidation structure-adaptive strategy for copper passivation.

Authors

Liu He, Jingwen Huang, Wenzhen Zheng, Xiaoyu Song, Jie Liu, Huiqiang Lu, Xiaohui Liu, Birong Zeng, Yiting Xu, Conghui Yuan, Lizong Dai

Published in

Nature communications. Volume 16. Issue 1. Pages 7615. Aug 15, 2025. Epub Aug 15, 2025.

Abstract

Despite enormous efforts, copper corrosion remains a key inducement causing huge economic losses in electrical, construction, and military industries, and deteriorates the performance of semiconductor devices. Here we show that a set of ligands functionalized with both catechol and aromatic amine groups achieves environmentally-adaptive copper passivation and fully preserves the intrinsic electrical and thermal conductivities of copper and its alloys. The oxidation of ligands in corrosive environments causes the structure-adaptation of the passivation layer, further enhancing the corrosion resistance to harsh environments including alkali and salt solutions, thermal treatment, and UV-light- and oxygen-enriched conditions. Simply adsorbing these ligands on the surface of copper, brass, copper powder, copper-based flexible printed circuits, and copper inks for flexible electronics results in strong liquid and air anticorrosion performances. Our copper passivation technique only requires a room temperature soaking procedure, providing a high industrialization possibility for copper protection, particularly in semiconductor electronics and flexible electronics.

PMID:
40817226
Bibliographic data and abstract were imported from PubMed on 16 Aug 2025.

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