Authors
Yuan Chai, Hong-Hua Fang, Zhen-Ze Li, Tian-Wei Wang, Shao-Feng Liu, Hong-Ren Chen, Shu-Chang Li, Xiao-Yan Li, Jia-Ming Lyu, Hong-Bo Sun
Published in
Light, science & applications. Volume 15. Issue 1. Jun 30, 2026. Epub Jun 30, 2026.
Abstract
While light scattering is widely utilized in optical metrology and measurement, it has long been regarded as detrimental in laser-material processing. Here, we report an interferometric scattering effect that overturns this conventional view by resolving the six-decade challenge of axial resolution in optical manufacturing. This breakthrough elevates the axial resolution from micrometers, e.g., ~2 µm in transparent solids slicing, to the sub-10 nm level. The underlying mechanism involves the controlled sequential generation of nano-scatterers through interference between the incident laser and deliberately seeded scattering centers. Based on this phenomenon, we developed an interferometric scattering-based optical tomoslicing technology (i-SOT), achieving kerf widths as narrow as 7 nm under an industrial standard efficiency of up to 400 mm²/s. This unprecedented axial resolution enables nearly lossless laser wafering from ingots-reducing mass loss from ~30% to below 1% - with transformative potential for manufacturing laser crystals, photovoltaics, and microelectronic chips.
PMID:
42380086
Bibliographic data and abstract were imported from PubMed on 01 Jul 2026.
Read full publication at:
Please sign in
to see all details.
Advertisement
Stats
- Recommendations n/a n/a positive of 0 vote(s)
- Views 3
- Comments 0