Authors
Tanglong Bai, Bokang Wang, Yurui Xing, Haolin Huang, Huixin Chen, Hongti Zhang
Published in
Small (Weinheim an der Bergstrasse, Germany). Pages e74560. Jul 09, 2026. Epub Jul 09, 2026.
Abstract
Silicon remains the cornerstone in today's immense semiconductor industry. At the nanoscale, silicon could exhibit large elasticity, which holds great potential for flexible electronics and 'elastic strain engineering'. Here, we report the influence of crystalline orientation, specimen size, strain rate, and electron beam irradiation on the ultra large (>10%) elastic deformation and fracture behavior of VLS-grown single crystalline silicon nanowires (Si NWs), and demonstrated that Si NWs grown along <110> directions exhibited greater strength and deformability than those along <111>. As the specimen diameters decreased, the fracture strength and strain of Si NWs doubled, and smaller specimens tended to 'fly away' upon fracture due to the substantial accumulated elastic potential energy. Results indicate that the intricate mechanical properties of Si NWs are susceptible to multiple intrinsic and extrinsic factors. By strategically manipulating the specific variables, the mechanical robustness and deformation tolerance of Si NW-based electronic devices can be tailored.
PMID:
42424645
Bibliographic data and abstract were imported from PubMed on 10 Jul 2026.
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