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Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility.

Created on 30 Jul 2026

Authors

Yuheng Jiang, Zihao Chen, Xiao Sun, Haotian Li, Jinlong Xie, Yueting Li, Xiaolei Nie, Feng Lan, Yaxin Zhang, Qiye Wen

Published in

Nano-micro letters. Volume 19. Issue 1. Jul 30, 2026. Epub Jul 30, 2026.

Abstract

Highly loaded magneto-dielectric composite systems are promising for achieving strong electromagnetic loss and structural design flexibility, yet their processability and geometric controllability remain extremely challenging. Herein, a rheologically engineered direct ink writing (DIW) 3D printing strategy is developed. Graphene (Gr) is introduced to reconstruct the particle-loading network, which synergistically improves the ink's yield behavior, shear-thinning property, structural recovery, and a magnetic-dielectric synergistic loss system is constructed with carbonyl iron powder (CIP). The critical CIP content (~ 84.06 wt%) is determined by the yield model, and a tunable Gr/CIP (GC) composite ink is obtained. The correlation among rheological response, geometric fidelity, and temporal stability is established, enabling high-fidelity 3D-printed gradient honeycomb structures. The rationally designed 3D-printed GC honeycomb (GCH) absorber achieves an effective absorption bandwidth of 18 GHz-4 THz, with an RLmin of - 84.30 dB at a thickness of 2.6 mm. When integrated into device-level terahertz reconfigurable intelligent surfaces (RIS), the GCH absorber contributes to a ~ 3.3 dBi main lobe gain enhancement, 1.9-3.3 dB sidelobe suppression, and a ~ 58% reduction in reflection beamwidth, showing excellent electromagnetic compatibility performance for communication, imaging, and radar. This work offers a practical strategy for the structural fabrication and device integration of high-load magneto-dielectric synergistic absorbers.

PMID:
42530783
Bibliographic data and abstract were imported from PubMed on 30 Jul 2026.

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