Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging.

Authors

Chungen Hsu, Chenlei Pang, Qinghua Lu, Seongku Kim

Published in

ACS applied materials & interfaces. Aug 07, 2026. Epub Aug 07, 2026.

Abstract

Advanced packaging technologies have enabled electronic devices toward miniaturization, higher integration densities, and scalable optoelectronic applications. Among the key materials for low-dielectric redistribution layers, photosensitive polyimides (PSPIs) have emerged as a suitable candidate, owing to their combined capabilities in photo-patterning ability, mechanical strength, and low dielectric loss. However, recent research challenges the conventional view of performance trade-offs, demonstrating that molecular design and thermal management can be synergistically codesigned to enhance device performance. This review summarizes the latest advances in the molecular design of multifunctional PSPI design and highlights their integration into wafer-level packaging architectures. We focus on their role in promoting efficient heat dissipation from chip to external package and on reducing dielectric losses to improve signal integrity. Finally, future directions for PSPI-based materials are proposed, offering a forward-looking perspective for next-generation high-performance and flexible electronics.

PMID:
42566687
Bibliographic data and abstract were imported from PubMed on 08 Aug 2026.

Read full publication at:
Please sign in to see all details.

Stats

1-terrible, 9-excellent. How would you rate this publication? Sign in in to submit your rating.

Post a comment

You need to be signed in to post comments. You can sign in here.

Comments

There are no comments yet.