Topology-Optimized Kirigami Design of Electrospun BNNS/PVA Composite Films for Flexible Electronics Thermal Management.

Authors

Yanyan Xu, Bin Xie, Mingxiang Chen, Xin Tang

Published in

Nanomaterials (Basel, Switzerland). Volume 16. Issue 15. Jul 28, 2026. Epub Jul 28, 2026.

Abstract

Flexible electronics require thermal-management materials that can efficiently dissipate heat while maintaining mechanical compliance under deformation. In this study, a topology-optimized kirigami BNNS/PVA composite film was developed by combining boron nitride nanosheet incorporation, electrospinning, and thermo-mechanical topology optimization. The electrospun BNNS/PVA network enhanced the in-plane thermal conductivity from 0.19 to 4.63 W/(m·K), while the optimized kirigami architecture improved deformation accommodation by reducing elastic strain energy accumulation. The average temperature and total elastic strain energy were reduced from 86 °C to 53 °C and from 43 J to 11 J, respectively. The optimized structure achieved a maximum stress of 2.39 MPa and a maximum strain of 5.02% and reduced the steady-state temperature by up to 21.27 °C under identical heating conditions. Furthermore, in-plane thermal conductivity was maintained after 300 bending cycles, which provides an effective material-structure design strategy for flexible electronic thermal management applications.

PMID:
42584319
Bibliographic data and abstract were imported from PubMed on 12 Aug 2026.

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