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Copper Peroxide-Loaded Dual-Responsive Hydrogel for Enhanced Diabetic Wound Healing Through Oxygen Release and Promotion of Angiogenesis.

Created on 26 Oct 2026

Authors

Lanqin Yu, Xiang Jia, Lejia Xu, Xiaojun Li, Na Li, Lihua Li, Yifan Zhang, Changren Zhou

Published in

Gels (Basel, Switzerland). Volume 12. Issue 10. Sep 24, 2026. Epub Sep 24, 2026.

Abstract

Diabetic foot ulcers (DFUs) present a major clinical challenge because of persistent hyperglycemia, hypoxia, impaired angiogenesis, and chronic inflammation. Conventional dressings have limited capacity to modulate these pathological processes. Here, we report a glucose/pH dual-responsive hydrogel, denoted CBOD, constructed through a dynamic covalent network comprising Schiff base and boronate ester bonds between phenylboronic acid-grafted chitosan (CS-BA) and dopamine-modified oxidized sodium alginate (OSA-DA). Copper peroxide (CuO2) nanoparticles are encapsulated within this network to form CuO2/CBOD. Under acidic (pH 5.5) and high-glucose conditions, competitive binding and bond hydrolysis promote network relaxation, facilitating the stimuli-dependent release of oxygen and copper ions. In vitro assessments demonstrate good cytocompatibility and enhanced migration and tube formation of human umbilical vein endothelial cells (HUVECs). In a diabetic rat model of full-thickness excisional wounds, the hydrogel accelerates wound closure, with closure approaching 100% by day 14. Treatment is associated with reduced expression of the M1-associated markers interleukin-1β (IL-1β) and cluster of differentiation 80 (CD80), increased expression of the M2-associated markers interleukin-10 (IL-10) and cluster of differentiation 163 (CD163), and enhanced expression of the vascular markers cluster of differentiation 31 (CD31) and alpha-smooth muscle actin (α-SMA). These findings support the potential of CuO2/CBOD as a multifunctional dressing for diabetic wound management.

PMID:
42929899
Bibliographic data and abstract were imported from PubMed on 26 Oct 2026.

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